Location:Shanghai Job Responsibilities: ? Responsible for routine PCB layout designs. ? Work close with hardware/process engineers to ensure circuit and process requirements are well defined and incorporated into the board design. ? Generate documents per design flow and rules, submit for peer review and attach to file system after that. ? Actively participate in technical discussions at the early design phase. ? Review and verify the layout designs per the checklist for others. ? Work close with PCB suppliers to make a "buildable" PCB/Flex, participate in DFM replies for some special cases. SKILLS/QUALIFICATIONS: ? BS or higher in electrical engineering or equivalent; ? 8+ years multilayer board design experience with RF, mixed-signal circuit and HDI, familiar with blind/buried vias application, capable of implementing guidelines into design; ? In Depth knowledge of High-Density Interconnect (HDI), substrate design and its associated design rules; ? Ability to derive a balanced design to satisfy manufacture ability and project goals such as performance & density; ? At least as an expert in one of PCB design tools, Mentor Pads design experience and Allegro is preferred; ? Experience on PCB post-processing tools like CAM350, AutoCAD, BluePrint is preferred; ? Know of rigid board manufacturing process, like Tenting, m-SAP and extended knowledge of FPC manufacturing is a plus; ? Self-motivated, hard-working, capable of completing assignments under the pressure of urgent schedule and high design requirements; ? Good English communication skill.