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ROLE PURPOSE:
Develop & sustain the process of die attach process, follow the engineering approach to work with MEEQ members to maintain and improve the stability of back grinding/ wafer saw process, reduce the production risk.
KEY TASKS & RESPONSIBILITIES:
· Response for the new product introducing in safe launch/risk production phase, including the technician/operator training / documentation/yield maintenance.
· Response for the yield improvement in DIE ATTACH process, maintain/driving MEEQ to define/develop the solution for the inline abnormality
· Response for the document maintain and renew to ensure the principle of the process guiding documents, including but not limited to Control plan/OCAP/WI or SOP/FMEA
· Response for designing experiment of development/improvement in DIE ATTACH process, to improve or resolve the inline issues.
· Response for the process yield/UPH maintenance, establish CIP/BKM team to make improvements.
· Response for the training of DIE ATTACH process,including the trainee/technician/operators about the necessary knowledge.
· Response for the interaction with customer, including the technical discussion during the NPI phase, customer complaint, line tour or audit.
JOB REQUIREMENTS:
· Above 5 years of experience relevant process work experience.
· Proficient in Back grinding/Saw process principle and equipment
· Be Skilled in use of statistical analysis software, like JMP. Minitab
· Be skilled in SPC logic and practice
· Be skilled in DMAIC/BKM approach for project management and driving
· Be skilled in FMEA/Control plan/OCAP/MRB/8D report approach and practice
· Necessary engineering mindset and manage skills of change control
· Could be fluently write with English, could fluently speak would be preferred
· Good team worker and well communicator will be preferred