需要有Wafer Bonding經(jīng)驗
職責描述:
1) 優(yōu)化機臺測試項目及spec;
Optimize offline monitor and spec of equipment;
2) 優(yōu)化線上產(chǎn)品流片過程中監(jiān)測項目及spec;
Optimize inline monitor and spec of equipment
3) review測試參數(shù),對超出spec的產(chǎn)品做異常處理及預防;
Review monitor data, dispose and prevent the OOC/OOS abnormal issue;
4) 建立系統(tǒng)化的生產(chǎn)作業(yè)流程,為生產(chǎn)遇到的問題提供解決方案,訓練工程師;
Setup and optimize operator OI, provide solution on operator issues, and training the engineer.
5) 解決工藝轉移過程中出現(xiàn)的問題,設計實驗方案, 徹底解決問題;
Resolve problems arisen from technology transfer, design experiment and provide final solution;
6) 新耗材及2nd source耗材評估;
New consumable & 2nd source consumable evaluation.
7) 與設備工程師及操作員合作解決生產(chǎn)中遇到的問題;
Co-work with EQ engineer for troubleshooting.
8) 制程需解決的特殊任務;
Resolve special issues for process requirement.
9) 獨立主導項目,與各功能負責人良好溝通,達成目標;
Lead a project and achieve goal, with good communication and team work.
任職要求:
1)大學本科及以上學歷,微電子、工科類相關專業(yè);
Bachelor degree or above, major in microelectronics, engineering;
2)5年以上半導體行業(yè)Bond工作經(jīng)驗;
5+ years’ experience in Bond process;
3)英語四級及以上,有較好的英文聽說讀寫能力;
CET-4 or above, Fluent in listening, speaking, reading & written English;
4)熟練使用office辦公軟件;
Competent in using MS-Office software;
5)良好的溝通能力和協(xié)作能力,結果導向。
Good communication and team work, result orientation.
職位福利:14薪、五險一金、年底雙薪、績效獎金、帶薪年假、免費班車、餐補、通訊補助