需要有Wafer Bonding經(jīng)驗(yàn)
職責(zé)描述:
1) 優(yōu)化機(jī)臺(tái)測(cè)試項(xiàng)目及spec;
Optimize offline monitor and spec of equipment;
2) 優(yōu)化線上產(chǎn)品流片過程中監(jiān)測(cè)項(xiàng)目及spec;
Optimize inline monitor and spec of equipment
3) review測(cè)試參數(shù),對(duì)超出spec的產(chǎn)品做異常處理及預(yù)防;
Review monitor data, dispose and prevent the OOC/OOS abnormal issue;
4) 建立系統(tǒng)化的生產(chǎn)作業(yè)流程,為生產(chǎn)遇到的問題提供解決方案,訓(xùn)練工程師;
Setup and optimize operator OI, provide solution on operator issues, and training the engineer.
5) 解決工藝轉(zhuǎn)移過程中出現(xiàn)的問題,設(shè)計(jì)實(shí)驗(yàn)方案, 徹底解決問題;
Resolve problems arisen from technology transfer, design experiment and provide final solution;
6) 新耗材及2nd source耗材評(píng)估;
New consumable & 2nd source consumable evaluation.
7) 與設(shè)備工程師及操作員合作解決生產(chǎn)中遇到的問題;
Co-work with EQ engineer for troubleshooting.
8) 制程需解決的特殊任務(wù);
Resolve special issues for process requirement.
9) 獨(dú)立主導(dǎo)項(xiàng)目,與各功能負(fù)責(zé)人良好溝通,達(dá)成目標(biāo);
Lead a project and achieve goal, with good communication and team work.
任職要求:
1)大學(xué)本科及以上學(xué)歷,微電子、工科類相關(guān)專業(yè);
Bachelor degree or above, major in microelectronics, engineering;
2)5年以上半導(dǎo)體行業(yè)Bond工作經(jīng)驗(yàn);
5+ years’ experience in Bond process;
3)英語四級(jí)及以上,有較好的英文聽說讀寫能力;
CET-4 or above, Fluent in listening, speaking, reading & written English;
4)熟練使用office辦公軟件;
Competent in using MS-Office software;
5)良好的溝通能力和協(xié)作能力,結(jié)果導(dǎo)向。
Good communication and team work, result orientation.
職位福利:14薪、五險(xiǎn)一金、年底雙薪、績效獎(jiǎng)金、帶薪年假、免費(fèi)班車、餐補(bǔ)、通訊補(bǔ)助