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崗位職責(zé):

2.0Job Summary 職位概述

Responsible for the full - life - cycle development of automotive thermal management E/E systems, covering from scheme design to mass - production support. Collaborate with cross - functional teams to ensure the balance of system performance, reliability, and cost, promote technological innovation, and enhance product competitiveness

負(fù)責(zé)汽車熱管理電子電氣系統(tǒng)全生命周期開發(fā)，涵蓋方案設(shè)計到量產(chǎn)支持，協(xié)同跨部門團(tuán)隊，保障系統(tǒng)性能、可靠性與成本平衡，推動技術(shù)創(chuàng)新，提升產(chǎn)品競爭力。

3.0Key Responsibilities 主要職責(zé)

3.1 System Development

Deeply analyze customers

requirements for automotive thermal management E/E systems, accurately identify key control indicators and special safety requirements. Lead the formulation of overall system solutions, review electrical architectures, complete the hardware selection of thermal management controllers, circuit schematic design, EMC design, and PCB design to ensure requirements of functionality, performance, and reliability, ensure stable system operation, proactively solve potential design problems, and output detailed analysis reports. Work closely with the software team to develop hardware - software interface specifications, jointly complete the functional integration and testing of the thermal management system. Participate in the review of software functional test cases and provide optimization suggestions based on hardware characteristics to ensure the integrity and coordination of system functions. Be responsible for the testing and verification of automotive thermal management E/E systems. Develop DVP plans, organize and implement functional tests, environmental tests, reliability tests, etc. Conduct in - depth analysis of test data, solve problems found during testing, output test reports, and provide a basis for product design optimization and quality improvement.

深度剖析客戶對汽車熱管理電子電氣系統(tǒng)需求，精準(zhǔn)識別關(guān)鍵控制指標(biāo)與特殊安全要求，主導(dǎo)制定系統(tǒng)總體方案，構(gòu)建電氣架構(gòu)，完成熱管理控制器硬件選型、電路原理圖及 PCB 設(shè)計，EMC的評審，確保滿足功能、性能、可靠性要求，保障系統(tǒng)穩(wěn)定運行，提前解決潛在設(shè)計問題，輸出詳細(xì)分析報告。與軟件團(tuán)隊緊密配合，制定硬件與軟件接口規(guī)范，協(xié)同完成熱管理系統(tǒng)功能集成與測試，參與軟件功能測試用例評審，基于硬件特性提供優(yōu)化建議，保障系統(tǒng)功能完整性與協(xié)調(diào)性。負(fù)責(zé)汽車熱管理電子電氣系統(tǒng)的測試驗證工作，制定 DVP 計劃，組織實施功能測試、環(huán)境測試、可靠性測試等，對測試數(shù)據(jù)深度分析，解決測試中發(fā)現(xiàn)的問題，輸出測試報告，為產(chǎn)品設(shè)計優(yōu)化和質(zhì)量提升提供依據(jù)。

3.2 Supplier and Collaboration Management/供應(yīng)商與合作管理

Collaborate with the purchasing department to screen component suppliers for automotive thermal management E/E systems. Participate in supplier evaluation and audit, develop technical requirements and quality standards, inspect suppliers

technical strength, production capacity, and quality systems, and establish a supplier resource library. Work closely with suppliers to conduct technical exchanges and joint development, monitor the development process of key components, participate in supplier product acceptance, and ensure that the quality, performance, and delivery schedule of components meet project requirements. Maintain good communication with external partners such as vehicle manufacturers and third - party testing institutions. Timely obtain industry trends, market demands, and changes in regulatory standards. Participate in technical docking and coordination of cooperative projects to promote the smooth progress of projects.

協(xié)同采購部門篩選汽車熱管理電子電氣系統(tǒng)零部件供應(yīng)商，參與供應(yīng)商評估與審核，制定技術(shù)要求與質(zhì)量標(biāo)準(zhǔn)，考察供應(yīng)商技術(shù)實力、生產(chǎn)能力與質(zhì)量體系，建立供應(yīng)商資源庫。與供應(yīng)商緊密合作，開展技術(shù)交流與聯(lián)合開發(fā)，對關(guān)鍵零部件開發(fā)過程進(jìn)行監(jiān)控，參與供應(yīng)商產(chǎn)品驗收，保障零部件質(zhì)量、性能與交付進(jìn)度符合項目要求。與汽車整車廠、第三方測試機(jī)構(gòu)等外部合作伙伴保持良好溝通，及時獲取行業(yè)動態(tài)、市場需求與法規(guī)標(biāo)準(zhǔn)變化，參與合作項目技術(shù)對接與協(xié)調(diào)，推動項目順利開展

3.3 Technical Innovation and Knowledge Management/技術(shù)創(chuàng)新與知識管理

Keep track of cutting - edge technologies in the field of automotive thermal management E/E, study the feasibility of applying new technologies to products, provide solutions for product technology upgrades and innovation, and promote the application of new technologies in company products. Collect, collate, and analyze industry standards, regulatory policies, and technical information of competitors in automotive thermal management E/E systems, provide a reference for the company

s product development, and enhance the company

s technical competitiveness. Summarize project experiences and lessons, write technical reports and case sharing, establish a technical knowledge base, provide technical training and guidance for team members, cultivate technical talents, and improve the overall technical level of the team.

跟蹤汽車熱管理電子電氣領(lǐng)域前沿技術(shù)，研究新技術(shù)在產(chǎn)品中的應(yīng)用可行性，為產(chǎn)品技術(shù)升級與創(chuàng)新提供方案，推動新技術(shù)在公司產(chǎn)品中的應(yīng)用。收集、整理、分析汽車熱管理電子電氣系統(tǒng)行業(yè)標(biāo)準(zhǔn)、法規(guī)政策與競爭對手技術(shù)資料，為公司產(chǎn)品開發(fā)提供參考依據(jù)，提升公司技術(shù)競爭力?？偨Y(jié)項目經(jīng)驗教訓(xùn)，撰寫技術(shù)報告與案例分享，建立技術(shù)知識庫，為團(tuán)隊成員提供技術(shù)培訓(xùn)與指導(dǎo)，培養(yǎng)團(tuán)隊技術(shù)人才，提升團(tuán)隊整體技術(shù)水平。

任職要求:

4.0Required education, experience, knowledge and skills 需要的教育、經(jīng)驗、知識及技能

?Bachelor or above degree with Mechanical, automotive or engineering related background.

?本科及以上學(xué)歷，電子信息工程、自動化、車輛工程（電子電氣方向）等相關(guān)專業(yè)。

?Minimum 3 years R&D working experience in automotive industry.

?3 年以上汽車電子電氣系統(tǒng)開發(fā)經(jīng)驗，至少 2 年專注于汽車熱管理電子電氣系統(tǒng)領(lǐng)域，有乘用車或商用車熱管理控制器開發(fā)成功項目經(jīng)驗者優(yōu)先。

?Have a thorough understanding of the principles of automotive E/E systems, the architecture and control strategies of thermal management systems, and be familiar with automotive E/E product development processes (such as the V - model development process, ASPICE standard), functional safety standards (ISO 26262), and EMC standards (CISPR, ISO 11452 series), etc.

?精通汽車電子電氣系統(tǒng)原理、熱管理系統(tǒng)架構(gòu)與控制策略，熟悉汽車電子電氣產(chǎn)品開發(fā)流程（如 V 模型開發(fā)流程、ASPICE 標(biāo)準(zhǔn)）、功能安全標(biāo)準(zhǔn)（ISO 26262）、EMC 標(biāo)準(zhǔn)（CISPR、ISO 11452 系列）等。

?Be proficient in using circuit design software (such as Altium Designer, OrCAD), PCB design software (such as Allegro), thermal analysis software (such as ANSYS Icepak), EMC analysis software (such as FEKO, CST), project management tools (such as Jira, Project), etc.

?熟練使用電路設(shè)計軟件（如 Altium Designer、OrCAD）、PCB 設(shè)計軟件（如 Allegro）、熱分析軟件（如 ANSYS Icepak）、EMC 分析軟件（如 FEKO、CST）、項目管理工具（如 Jira、Project）等。

?Have good English reading and writing skills, be able to read and write English technical documents, conduct English technical exchanges, and be proficient in using Office software.

?具備良好的英語讀寫能力，能夠閱讀和撰寫英文技術(shù)文檔，進(jìn)行英語技術(shù)交流，熟練使用 Office 辦公軟件。