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KEY TASKS & RESPONSIBILITIES:
工作職責(zé):
§ Technical skills and knowledge on assembly packaging.
§ Lead project for New Product Introduction.
§ Review the new device, package design of customer’s enquiries.
§ Plan and organize assembly evaluation for New Product Introduction
§ Prepare presentation material and compiled technical assembly report for the project.
§ New Project execution thru APQP methodology and update/upload in NPI system.
§ Other tentative jobs assigned by dept.
JOB REQUIREMENTS:
任職資格:
§ Bachelor’s Degree in Electronics, Electrical, Mechanical Engineering or related engineering discipline.
§ Over 1 years working experience in related processes in high volume electronics manufacturing environment preferably semiconductor.
§ Knowledge in APQP, DOE, SPC, FMEA and MSA.
§ Apply full understanding of engineering principles in performing job responsibility.
§ Good command in both spoken and written in English and Chinese / Mandarin.
§ Knowledge in Microsoft Office.
§ Able to work with cross functional team and with minimum supervision.
§ Effective interpersonal and communication skills.