職位描述
電子/半導(dǎo)體/集成電路
Responsibilities and Main Tasks:
1. Lead and optimize PCB manufacturing processes including Relam, Laser Drilling, and Plating to ensure high quality and efficiency.
2. Drive continuous improvement initiatives and implement best practices across processes.
3. Manage cross-functional projects related to Process Enhancement, Cost Reduction, and Stability.
4. Support New Product Introduction by evaluating process feasibility and ensuring smooth transition to mass production.
5. Collaborate with equipment and material suppliers to introduce and validate new solutions.
6. Provide Technical Training and Mentorship to Engineers of Production Engineering teams.
7. Monitor Key Process Indicators and lead Root Cause Analysis for any Deviations.
8. Ensure compliance with industry standards, customer requirements, and internal quality systems.
9. Support cross-functional project teams in process development, technology transfer, and cost reduction initiatives.
10. Participate in project planning, milestone tracking, and risk assessment for process-related projects.
11. Assist in evaluating and implementing new equipment, automation solutions, and digital tools to enhance manufacturing capabilities.
12. Collaborate with TDI, Engineering, Quality, and maintenance teams to ensure alignment between process requirements and project goals.
13. Support documentation and reporting for project status, technical findings, and improvement results.
Requirement：
1. Education and Experience Requirements:
1) Bachelor’s degree or above in Materials Science, Electronics, Mechanical Engineering, Chemical Engineering, or related technical fields.
2) Minimum 10 years of hands-on experience in PCB manufacturing, with deep expertise in lamination, laser drilling, and plating processes.
3) Strong analytical skills and ability to work independently in a fast-paced production environment.
4) Good communication skills in English, with the ability to collaborate across teams and functions.
5) Minimum 2–3 years of Experience in Managing or Leading Technical teams or cross-functional projects within the PCB manufacturing industry.
2. Technical Expertise:
1) In-depth knowledge of PCB manufacturing processes, especially lamination, laser drilling, and plating.
2) Familiarity with process control tools such as SPC, DOE, and FMEA.
3) Ability to interpret engineering drawings, specifications, and quality standards.
3. Project Management Skills:
1) Capable of leading or supporting cross-functional projects, including NPI and process improvement initiatives.
2) Strong organizational and time management skills to handle multiple tasks and deadlines.
3) Experience in project planning, milestone tracking, and risk mitigation.
4. Problem-Solving & Analytical Thinking:
1) Strong root cause analysis and troubleshooting capabilities.
2) Data-driven mindset with ability to use statistical tools and software for analysis.
5. Communication & Collaboration:
1) Effective verbal and written communication in both English and Chinese.
2) Ability to work collaboratively with engineering, production, quality, and supplier teams.
3) Skilled in presenting technical findings and project updates to stakeholders.
6. Adaptability & Continuous Learning:
1) Open to new technologies and process innovations.
2) Willingness to learn and share knowledge across teams.
Once a resume is submitted to the recruiting company, it is considered that the applicant agrees to the collection, processing, use, and disclosure of their resume and other personal information by the recruiting company for recruitment purposes.
一旦向招聘公司投遞簡歷，即視為應(yīng)聘者同意招聘公司基于招聘目的而對其簡歷和其他個人信息進行收集、處理、使用和披露等。
一旦向招聘公司投遞簡歷，即視為應(yīng)聘者同意招聘公司基于招聘目的而對其簡歷和其他個人信息進行收集、處理、使用和披露等。
工作地點
奧特斯(中國)有限公司上海市閔行區(qū)莘莊工業(yè)區(qū)金都路5000號
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奧特斯科技(重慶)有限公司奧特斯是全球領(lǐng)先的高品質(zhì)半導(dǎo)體封裝載板和印制電路板制造商，企業(yè)致力于生產(chǎn)和開發(fā)具有前瞻性的聯(lián)接技術(shù)，核心領(lǐng)域涵蓋移動設(shè)備、汽車和航天、工業(yè)電子、醫(yī)療與健康以及高性能虛擬現(xiàn)實和人工智能芯片應(yīng)用領(lǐng)域。作為一家飛速發(fā)展的跨國公司，奧特斯全球擁有13,500多名員工，分別在奧地利（萊奧本、菲嶺）、印度（南燕古德）、中國（上海、重慶）和馬來西亞（居林）擁有生產(chǎn)基地。奧特斯扎根中國發(fā)展逾20年，分別在上海（2001年）和重慶（2011年）建立生產(chǎn)基地。奧特斯（中國）有限公司成立于2001年，主要生產(chǎn)高密度互連印制電路板（HDI）和半導(dǎo)體封裝載板（IC substrates），客戶涵蓋業(yè)界頂尖的消費電子制造商、智能手機制造商、半導(dǎo)體制造商和汽車電子制造商。公司地址：上海市閔行區(qū)莘莊工業(yè)區(qū)金都路5000號。奧特斯科技（重慶）有限公司建立于2011年，是奧特斯集團在中國設(shè)立的第二家獨資企業(yè)，現(xiàn)有員工約5000人。奧特斯目前在中國重慶工廠投資兩大尖端技術(shù)，生產(chǎn)全球領(lǐng)先的半導(dǎo)體封裝載板和模組產(chǎn)品，產(chǎn)品應(yīng)用于電腦微處理器、移動設(shè)備、可穿戴設(shè)備和高端物聯(lián)網(wǎng)產(chǎn)品。作為一家高新技術(shù)企業(yè)，奧特斯重慶率先將全球最先進半導(dǎo)體封裝載板生產(chǎn)技術(shù)引入中國，是中國首家高端半導(dǎo)體封裝載板制造商。公司地址：重慶市江北區(qū)魚嘴鎮(zhèn)長和路58號。奧特斯通過將核心業(yè)務(wù)與新技術(shù)相結(jié)合，擴展其在價值鏈中的地位，迎接市場機遇，推動企業(yè)的可持續(xù)性發(fā)展。奧特斯的解決方案推動著5G、物聯(lián)網(wǎng)、自動駕駛以及人工智能等未來技術(shù)的創(chuàng)新。奧特斯將保持可持續(xù)、盈利性增長，鞏固其在半導(dǎo)體封裝載板領(lǐng)域的市場地位，實現(xiàn)“先進解決方案的首選”這一宏偉愿景目標。(特別說明：我司所有招聘工作按照RBA用工要求，充分尊重人權(quán)，人員招聘無宗教信仰/性別等歧視，不招聘童工。對未成年工不安排接觸職業(yè)危害的崗位，不安排倒班。)
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