職責(zé)描述:
1.Develop high aspect ratio Si Dry Etching process, and responsible for the process set up, and optimization.
開發(fā)刻蝕(高深寬比)工藝,負(fù)責(zé)工藝設(shè)置、優(yōu)化。
2.Complete micro-structure measurement and data analysis.
完成微結(jié)構(gòu)分析測(cè)量和數(shù)據(jù)分析。
3.Extend new equipment to fully release.
擴(kuò)展新設(shè)備到量產(chǎn)。
4.Continuously Improve Process: reduce defect density and improve the process performance.
持續(xù)改進(jìn)工藝:降低缺陷密度,提高工藝性能。
5.Write technical documents including patent, experiment report, etc.
撰寫專利、實(shí)驗(yàn)報(bào)告等技術(shù)文件。
6.Organize the process training for engineering.
組織工藝技術(shù)培訓(xùn)。
任職要求:
1.Master’s degree or above in Electronics, Physics, Material Science, Semiconductor or other related science and engineer
碩士及以上學(xué)歷,電子、物理、材料科學(xué)、半導(dǎo)體或相關(guān)科學(xué)與工程專業(yè)。
2.At least 3 years of process development or maintenance experience in Dry Etching or DRIE (Deep Reactive Ion Etching) area.
至少3年干法蝕刻或深硅刻蝕(DRIE)的工藝開發(fā)或維護(hù)經(jīng)驗(yàn)。
3.1Familiar with Dry Etching related process and measurement (equipment operation and recipe editing).
熟悉干法蝕刻相關(guān)的工藝和測(cè)量(包括設(shè)備操作和菜單編輯)。
4.Familiar with the configuration and working principle of the Dry Etching platform, and could independently create, modify, and optimize the process recipes.
熟悉干法刻蝕平臺(tái)的配置和工作原理,能獨(dú)立創(chuàng)建、修改、優(yōu)化工藝菜單。
5.Hands-on ability at dry etching.
較強(qiáng)的干法刻蝕的動(dòng)手能力。
6.Proficient in office software such as Excel, PPT, etc.
熟練使用Excel、PPT等辦公軟件。
7.Fluent English speaking and writing skill.
流利的英語聽說讀寫能力。
8.Experience in process development in 8-12 inch Fab is preferred.
有8-12英寸工廠工藝開發(fā)經(jīng)驗(yàn)者優(yōu)先。