Key Qualifications
● Over 7 years of hands-on experience in semiconductor IC or module packaging,
especially on Camera Module or related processes.
● Process technology knowledge in SMT and advanced IC / camera module
packaging areas
● Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire
Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active
Alignment Process & etc.
● Experienced working with subcontract manufacturing partners.
● High volume manufacturing, and production ramp experience.
● Knowledgeable in production control processes, machine commissioning, data
analysis/interpretation GR&R, Cp/Cpk and correlation analysis
● Fluent in English communication, additional language skills a plus.
● Demonstrated ability to perform DOE, data analysis, SPC control.
● Demonstrated failure mode analysis, root cause investigation, and problem
solving for product yield and quality issue.
● Project Management- Excellent data handling, documentation, critical milestone
creation, and organization skill
● Strong collaboration skill to work with diversified x-function team.
Description
● Develop Camera Module assembly process / equipment / materials for FOL
(Front of Line) and EOL (End of Line) - Develop new assembly process /
equipment / material for Camera module related components - Provide technical
leadership in resolving any process issues - Responsible for developing DOEs,
Statistical Process Analysis, Process Specification, D/PFMEA and Process
control plan - Responsible for Failure analysis, Corrective actions and Yield
improvement
● Process technology feasibility studies through theoretical simulation and/or
practical engineering methods Process Development - Leads design and
development of technically complex manufacturing processes including material
selection, parameter optimization, equipment, metrology, and system design to
enable new products designs & functional requirements.
● Develop Process for Manufacturability - Provide early and ongoing manufacturing
leadership to ensure new process is scalable for high volume Process FMEA -
Lead PFMEA generation for new process technology Failure Analysis - Lead root
cause analysis and metrology development for issues related to new process
technology.
● Supporting complex, high volume camera module modules. Provide leadership in
the areas of module construction, materials, equipment, and processes.
● Identify the correct product process flow, compatible with high volume
manufacturing requirements. Work to develop key and new
process/equipment/material for camera module. Participate in external vendor
assessment and selection, from MP intent equipment, process, to direct and
indirect materials. Responsible for DOE planning, statistical process analysis,
process specification, and D/PFMEA.
Education & Experience
B.S. degree in Engineering (Mechanical, Electronics, Electrical, Physics, or
equivalent)