The Impact You'll Make
Process development and material verification of semiconductor power modules.
What You’ll Be Doing
- Lead process development of semiconductor power modules, e.g. die bonding, soldering, wire bonding, pin and terminal welding
- 主導(dǎo)完成半導(dǎo)體功率模塊工藝開(kāi)發(fā),如:貼片,焊接,引線(xiàn)鍵合, pin針和功率端子超聲焊
- Lead material verification of semiconductor power modules, e.g. baseplate, solder paste/preform, DBC/AMB, chip, bonding wire, housing, silicone gel
- 主導(dǎo)完成半導(dǎo)體功率模塊材料驗(yàn)證,如:基板,錫膏/焊片, DBC/AMB,芯片,綁定線(xiàn),外殼,硅凝膠
- Design fixtures and jigs for process and material verification
- 設(shè)計(jì)工裝夾具完成相應(yīng)的工藝和材料驗(yàn)證
- Identify optimum process parameters by DOE
- 通過(guò)實(shí)驗(yàn)設(shè)計(jì)識(shí)別最優(yōu)工藝參數(shù)
- Identify process defects by material analysis, and propose solutions for optimization
- 通過(guò)材料分析識(shí)別工藝缺陷,并提出優(yōu)化方案
- Create equipment technical specification based on process requirements
- 根據(jù)工藝要求制定設(shè)備技術(shù)規(guī)范
What We're Looking For
Bachelor’s degree or above, majoring in Power Electronics, mechanical engineering, material science or a comparable field of study.
本科及以上學(xué)歷,電力電子、機(jī)械工程、材料科學(xué)或相關(guān)專(zhuān)業(yè)
Over 5 years of work experience in power semiconductor industry, at least 3 years of process development and material verification of power modules, experience in project management is preferred
5年以上功率半導(dǎo)體從業(yè)經(jīng)驗(yàn),至少3年功率模塊工藝開(kāi)發(fā)和材料驗(yàn)證經(jīng)驗(yàn),有項(xiàng)目管理經(jīng)驗(yàn)優(yōu)先
Proficient in using at least one of the mechanical design software, e.g. NX, SolidWorks
熟練掌握和使用至少一種機(jī)械制圖軟件,如:NX,Solidworks
Knowledge of ISO-GPS standards, and ability to create engineering drawings as required
了解ISO-GPS標(biāo)準(zhǔn),能夠按要求輸出工程圖紙
Hands-on experience in power module production process (printing, die attach, vacuum soldering, aluminum wire bonding, pin soldering/welding, etc.)
具有功率模塊生產(chǎn)工藝實(shí)際操作經(jīng)驗(yàn)(印刷,貼片,真空焊接,鋁線(xiàn)綁定,pin針焊接等)
Deep understanding of IGBT/SiC chip materials, packaging materials and their features (baseplate, housing, DBC/AMB, solder paste/preform, bond wire, silicone gel, etc.)
深度理解IGBT/SiC芯片材料、封裝材料極其特性(基板,外殼,DBC/AMB,錫膏/焊片,綁定線(xiàn),硅凝膠等)
Familiar with insulation coordination in power module design, and basic understanding of reliability tests
熟悉功率模塊設(shè)計(jì)中的絕緣規(guī)范,了解可靠性測(cè)試項(xiàng)目
Fluent in English, able to write technical documents in English and communicate in global technical meetings
英語(yǔ)流利,能撰寫(xiě)英文技術(shù)文檔和參與全球技術(shù)會(huì)議
Proficient in Office software
熟練掌握Office辦公軟件
Teamwork mentality and good communication skills
團(tuán)隊(duì)合作意識(shí),良好的溝通能力
What You'll Get from Us
- We promote from within and support your learning with mentoring, training, and access to global opportunities.
- You’ll have flexibility, autonomy, and support to do your best work while maintaining a healthy work-life balance. Your well-being matters to us.
- We strive to create an inclusive work environment where people of all backgrounds are respected, and valued for who they are.
- You’ll receive benefits like 13th salary, annual bonus, paid vacation, pension plans, personal insurance, and more. These vary by country and contract, but they’re worth asking about—we think they’re pretty great.
Ready to Make a Difference?
If this role excites you, we’d love to hear from you! Apply now to start the conversation and learn more about where your career can go with us.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, veteran status, or other protected category.